AMD Ryzen 9 9950X3D2 Dual Edition processor 4.3 GHz 192 MB L3 Box

Name: AMD Ryzen 9 9950X3D2 Dual Edition processor 4.3 GHz 192 MB L3 Box
Brand: AMD
SKU: 100-100001978WOF
Price: 919.75 GBP
Availability: InStock

SKU

100-100001978WOF

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Special Price £766.46 £919.75 Regular Price £779.45 £935.34

In stock

Socket AM5, 16 cores, 32 threads, 4.3 GHz base clock, 5.6 GHz boost clock, 192 MB cache, 200 W, Box

Category: Processors

More Information

More Information
SKU	100-100001978WOF
EAN	0730143318327
Manufacturer	AMD
Availability	Y
Product Family	Ryzen
Product Series	9
Meta Description	Socket AM5, 16 cores, 32 threads, 4.3 GHz base clock, 5.6 GHz boost clock, 192 MB cache, 200 W, Box

Description

The World’s First Dual AMD 3D V-Cache™ Technology-Based Processor to Unlock a New Future of Computing for Developers and Creators.

Specifications

Processor
Processor generation	AMD Ryzen 9000 Series
Processor base frequency	4.3 GHz
Processor manufacturer	AMD
Cooler included	No
Processor codename	Granite Ridge AM5
Thermal Design Power (TDP)	200 W
Processor cache	192 MB
Processor model	9950X3D2
Processor threads	32
Processor operating modes	64-bit
Compatible chipsets	AMD A620, AMD X670E, AMD X670, AMD B650E, AMD B650, AMD X870, AMD X870E, AMD B840, AMD B850
Processor boost frequency	5.6 GHz
Processor lithography	4 nm
Processor family	AMD Ryzen™ 9
Processor cores	16
Processor socket	Socket AM5
Processor cache type	L3
Package type	Box
Memory
Maximum internal memory supported by processor	256 GB
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	5600,3600 MHz
Memory channels	Dual-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	AMD Radeon Graphics
On-board graphics card	Yes
On-board graphics card base frequency	2200 MHz
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	5.0
Supported instruction sets	AES, AVX-512, AVX 2.0, AVX, FMA3, SSE2, SSE4.2, SSE4.1, SSE3, SSE, SSSE3
Compatible operating systems	Windows 10/11 x64, RHEL x86 64-bit, Ubuntu x86 64-bit
Thermal Design Power (TDP)	200 W
Market segment	Desktop
Processor cache type	L3
Features
Maximum number of PCI Express lanes	28
Thermal Design Power (TDP)	200 W
PCI Express slots version	5.0
Supported instruction sets	AES, AVX-512, AVX 2.0, AVX, FMA3, SSE2, SSE4.2, SSE4.1, SSE3, SSE, SSSE3
Compatible operating systems	Windows 10/11 x64, RHEL x86 64-bit, Ubuntu x86 64-bit
Market segment	Desktop
I/O configuration
USB version	2.0/3.2 Gen 2 (3.1 Gen 2)
USB ports quantity	5
Packaging data
Package type	Box

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SKU	100-100001978WOF	100-000000341	100-000000327	100-000001134	100-000000345	100-000000344
Manufacturer	AMD	AMD	AMD	AMD	AMD	AMD
Categories	N/A	N/A	N/A	N/A	N/A	N/A
Processor lithography	up to 22nm	N/A	N/A	N/A	N/A	N/A
Processor family	AMD Ryzen 9	AMD EPYC	AMD EPYC	AMD EPYC	AMD EPYC	AMD EPYC
Processor socket	Socket AM5	Socket SP3	Socket SP3	Socket SP6	Socket SP3	Socket SP3
Processor cores	16	32	8	24	32	64
On-board graphics card	Y	N/A	N/A	N	N/A	N/A
Discrete graphics card	N	N/A	N/A	N	N/A	N/A
Cooler included	N	N/A	N/A	N	N/A	N/A
Package type	Box	Tray	Tray	Tray	Tray	Tray